Company History
2018
Moving to a big building and our headquarters
Patent registration: Transparent printed circuit board, method of manufacturing the same, and LED module using the same
Patent registration: Transparent printed circuit board, method of manufacturing the same, and LED module using the same
2017
Patent registration : Printed circuit board, manufacturing method thereof, and LED module and LED lamp using the same
2016
Installation of PB Free Wave Solder Line.
2015
Patent pending: Transparent printed circuit board, method of manufacturing the same, and LED module using the same
2014
Patent pending: Printed circuit board having low thermal resistance and method of manufacturing the same
2013
Expansion of SMT 1 line and Wave Solder Line
Founding Research & Development Center.
Founding Research & Development Center.
2012
Patent registration : RFID STACKED TAG
PCB development for FFC(Flexible Flat Cable)
Launching SMT(Surface Mounting Technology) and assembly business.
PCB development for FFC(Flexible Flat Cable)
Launching SMT(Surface Mounting Technology) and assembly business.
2011
Moving to new building.
2010
Tag development and mass production for RFID.
Registration as venture business company(Ministry of SMEs and Startups)
Registration as INNO-BIZ Business company(Ministry of SMEs and Startups)
► Selected as one of promising small and medium business company of Gyounggi-do.
Registration as venture business company(Ministry of SMEs and Startups)
Registration as INNO-BIZ Business company(Ministry of SMEs and Startups)
► Selected as one of promising small and medium business company of Gyounggi-do.
2009
Manufacturing of MLB PCB for motor battery test.
2008
Registration as one of technical partners of Korea Polytechnic University
Development of Build-up PCB for LED.
Selected as specialized company of components and materials.(Ministry of Trade, Industry and Energy)
Development of Build-up PCB for LED.
Selected as specialized company of components and materials.(Ministry of Trade, Industry and Energy)
2007
Development of 56 layers PCB.
2006
ISO 9001 certificate
Development of 52 layers PCB
Development of 52 layers PCB
2005
Development of 48 layers PCB
Registration as business partner of Daewoo Electronics
Registration as business partner of Daewoo Electronics
2004
► JDM Co. Ltd. changeover as cooperation
Development of 42 layers PCB
Development of 42 layers PCB
2003
Development of 34 layers PCB
Development of low leakage B/D
Development of low leakage B/D
2002
Registration as business partner of Samsung Electricity
Foundation of JDM.
Foundation of JDM.